PROFESSIONALS ENSURE DEVELOPMENT IS IN THE BEST HANDS Passive assembly with 0.5 μ at 850°C
Aifotec offers eutectic bonding with laser based spot size
Eutectic Bonding Precision placements with high reliability and yield via
spot-size and heat plate-based eutectic bonding
Epoxy Bonding Passive and active assembly with the highest level of accuracy
Aifotec uses both light-curing and conductive epoxides
Fibre Coupling Our patented technology combines individual fibres or fibre arrays with their chip.
Both passive and active methods are used for chip fibre coupling.
Laser-Based Spot Size Eutectic Bonding

Our lasers guarantee the fastest eutectic bonds

Heat Plate-Based Eutectic Bonding

Highest reliability and yield

Epoxy Bonding

Passive assembly of VCSELs, lenses or injection moulded parts

Fibre Coupling

Aifotec assembles fibres or optical cables with active coupling to your chip

Aifotec is a recognised specialist in integrated circuit packaging for photonic and semi-conductor components. Our speciality is high-precision, fully automatic assembly.

Aifotec supports all leading process equipment such as glass, ceramic, polymer and silicon with laser spot size die bonding. We also support advanced oven-based epoxy bonding technologies.

Laser-Based Spot Size Eutectic Bonding

Aifotec’s laser-based spot size bonding provides precise passive assembly of up to ± 0.5 μm @ 3 sigma. The advantage of our technology is as follows: The local heat penetration through the laser system guarantees a very fast eutectic bonding process with little oxide formation and low heat impact on neighbouring fields

Laser_Based_-Eutectic_Bonding

Technical Specifications:

  • Fast heating up times due to powerful laser
  • Variable size and shape of the laser spot
  • Adjustable temperature profiles up to 850°C
  • Heatable tool up to 350°C
  • Bonding force of 3 g-5000 g
  • Adjustable process gas
  • Device holder by Waffle Pak and Gel Pak or Blue Tape
  • Individual components through to wafers
  • Individual pickup tools allow for a large selection of components
  • Flip chip capability
  • Post-bond accuracy measurement
  • Shear force measurement
  • Wafer mapping
  • Data tracking

Heat Plate-Based Eutectic Bonding

The eutectic bond through our heat plate system offers our customers the option to assemble even very large components with an accuracy of ± 1.5 μm.

Technical Specifications:

  • Active alignment of planarity by interferometer measurement
  • Large heating plate of up to 2.5″
  • Adjustable temperature profiles up to 400°C
  • Bonding force of 30 g-150 g
  • Adjustable process gas, formic acid or forming gas
  • Pickup from Waffle Pak and Gel Pak
  • Individual pickup tools allow for a large selection of components
  • Post-bond accuracy measurement
  • Shear force measurement
  • Wafer mapping
  • Data tracking
Eutectic_Bonding_Aifotec

Epoxy Bonding

Epoxy technology using a light-curing or conductive epoxy, as well as passive or active adjustment allow for multiple component assembly options.

Epoxy_Bonding

Technical Specifications:

  • Fast curing times due to powerful UV unit
  • Dosing systems with different tools
  • Bonding force of 30 g-150 g
  • UV-curing epoxy
  • Heat-curing epoxy
  • Individual pickup tools allow for a large selection of individual components
  • Post-bond accuracy measurement
  • Adjustable process gas
  • Shear force measurement
  • Wafer mapping
  • Data tracking

Fibre Coupling

Aifotec realises the active optical coupling of individual fibres or fibre arrays to your chip.
The active coupling is realised with the optical cables using a technology patented by Aifotec with the smallest external dimensions.

Technical Specifications:

  • Active alignment and coupling
  • Customised substrate and fibre holder
  • Light-curing epoxy bonding with UV source 
  • Wavelength measurement
  • Polarisation measurement
  • Performance measurement
Fibre_Coupling_Aifotec

For you as a customer, the equipment is specified, selected and improved. This ensures that your requirements as a customer are optimally fulfilled.

Our suppliers confirm that Aifotec has the most modern equipment and applies the most innovative procedures.